PACK EXPO International 2024 is set to have several new wrinkles when it returns from Nov. 3 to 6 at McCormick Place in Chicago. The event, produced by PMMI, The Association for Packaging and Processing Technologies, will connect 45,000 packaging and processing professionals.

PACK EXPO International will transform more than 1.3 million net square feet of exhibit space into a vibrant hub for professionals seeking to connect. Exhibitor and member lounges, sponsored by Lenze Americas, industry-specific pavilions, and special association events such as the Cold Pressure Council Annual Conference and the F4SS Fall Connect, will offer packaging and processing professionals valued meeting and collaboration venues.

“PACK EXPO International uniquely brings together the entire spectrum of the packaging and processing community. With more than 2,500 exhibitors and 45,000 attendees representing over 40 vertical markets, it is the premier event for packaging and processing professionals looking to innovate and make valuable industry connections,” says Laura Thompson, vice president of Trade Shows, PMMI.

Comic relief

A special event this year will be PACK gives BACK, headlined by comedian Nate Bargatze. Scheduled for Monday, Nov. 4, at the Lakeside Center’s Arie Crown Theater, the evening will commence with a pre-show networking event, followed by Bargatze’s performance. Tickets are $95 each, with a special offer: buy nine, get one free. All proceeds will support the PMMI Foundation, which furthers packaging and processing education throughout North America.

Immediately following PACK gives BACK on Monday, Nov. 4, PMMI’s Young Professionals Network will host a networking reception at Flight Club Chicago. This event provides a platform for emerging leaders in the industry to network and exchange ideas in a dynamic setting.‍

The following morning, Tuesday, Nov. 5, will feature the return of the Packaging & Processing Women’s Leadership Network Breakfast. This popular event will feature Lisa Sun, founder and CEO of retail brand and lifestyle company GRAVITAS, who will share her inspiring story, providing data-driven insights and practical tips to help motivate all in attendance to step up and stand out.

Educational opportunities

PACK EXPO will offer more than 150 free educational sessions. This year, two exciting new show features, Emerging Brands Central and Sustainability Central, will take center stage, offering attendees cutting-edge insights and strategies to propel their businesses forward.

Located in the West Hall at Booth W-20049, Emerging Brands Central is a must-visit destination for rising brands looking to scale their operations and expand their reach. This educational hub, an evolution of the Emerging Brands Summit, will host 30-minute sessions led by industry experts. These sessions will cover a range of topics including packaging machinery and innovation and scaling strategies, providing actionable advice for brands eager to grow. 

Making its debut at PACK EXPO International 2024, Sustainability Central is set to become the epicenter of sustainable packaging innovation. Located in the West Hall at Booth W-21020, this new feature will provide a comprehensive look at what sustainability means for brands today.

“PACK EXPO International 2024 is not just an exhibition; it’s a global hub for innovation and education,” says Thompson. “With the introduction of Emerging Brands Central and Sustainability Central, we’re providing attendees with unparalleled access to cutting-edge strategies and solutions that are shaping the future of our industry. This is the place where ideas become reality and where professionals come to expand their knowledge and drive their businesses forward.”

In addition to these new features, PACK EXPO International will host a multitude of educational stages and pavilions where attendees can dive into specialized topics and learn from global industry leaders. Highlights include:

• Innovation Stage: Three stages located in the North Hall (Booths N-4560, N-4580, N-4585) will present free 30-minute seminars on breakthrough technologies and industry-specific solutions such as artificial intelligence (AI), robotics, design, and sustainability.
• Processing Innovation Stage: Focused on food and beverage processing advancements, this stage will cover topics such as food safety and sustainability in 30-minute sessions at Lakeside Upper Hall, Booth LU-7147.
• Industry Speaks: Experts from the PACK EXPO International Partner Program, covering multiple industry verticals, address the latest hot topics and industry trends such as sustainability, safety, AI, automation, design, and robotics. Located at Booth N-4544 in the North Hall.
• Reusable Packaging Learning Center: Sponsored by the Reusable Packaging Association, the Reusable Packaging Learning Center (Booth LU-6737 in Lakeside Upper Level) will offer insights into how reusable packaging systems can drive efficiency and sustainability in the supply chain and cover topics such as logistics, improving material handling performance, and value assessment.

The future of the industry

PACK EXPO International will also look to the next generation, featuring a variety of activities aimed at introducing high school and college students to opportunities within the industry. These activities include:                    

• Girl Scout Event: New to the show, local Chicago Girl Scout Troops will receive credit for their Sustainable Packaging Patch. Scouts will meet in the Student Lounge on Sunday, Nov. 3, at 11 a.m. for a hands-on project focusing on sustainability. Lunch will be provided followed by a panel and show floor tour from industry professionals.
• Silent Auction: Foundation Fundraiser: New to the show, the Silent Auction will take place Sunday through Wednesday. Notable items up for bid include accommodations at premier Chicago-area hotels, including the Langham, Sheraton Grand Riverwalk, LondonHouse, Loews, and the InterContinental Magnificent Mile. In addition, premium wine and spirits, gift cards, and more are available. All bidding will occur virtually, and items will be displayed on the Grand Concourse, Level 2.5. Proceeds will benefit the PMMI Foundation.
• PACK Challenge: Returning for its second year, the PACK Challenge, sponsored by PepsiCo, invites six high school teams to participate in a machine-building competition. Competitors will demonstrate their skills by constructing full-scale material-handling machines capable of denesting and orientating paper coffee cups. This event will take place in the West Hall Lobby at Booth W-16005.
• Future Innovators Robotics Showcase: In this event, sponsored by Schneider Electric, attendees will be able to witness cutting-edge robotics from high school teams across the country. These students will showcase their design, engineering and troubleshooting prowess in the West Hall at Booth W-21052.
• Amazing Packaging Race: Sponsored by Emerson, this dynamic competition involves college and university students from across North America who will navigate the expo floor, engaging in tasks set by participating exhibitors. This event highlights student creativity and fosters teamwork and practical industry engagement.
• Students PACK the EXPO: On Nov. 5, PMMI will host local area students from Indiana, Illinois, and Wisconsin for a comprehensive expo experience. Activities will include a scavenger hunt, student tours, and a lunch-and-learn session to deepen their understanding of the industry.
• Student Tours: PMMI staff will conduct tours of the show floor daily at 10 a.m. and 2 p.m. Tours start at the PMMI U/PMMI Foundation Booth at W-20022 (West Hall). Interested students should meet at the PMMI U Booth 10 minutes prior to the starting time. No pre-registration is required.

Further enhancing the student experience, PACK EXPO International will offer dedicated spaces for networking and professional development. In addition, The Packaging & Processing Women’s Leadership Network will host events to connect aspiring professionals with industry experts, providing mentorship and career advancement platforms. 

Lastly, a Student Lounge will offer PMMI HR professionals, who will conduct workshops focused on interview best practices and resume writing, equipping students with essential tools to enter the workforce.

“These initiatives reflect our commitment to bridging the skills gap in the packaging and processing industries,” concludes Thompson. “By connecting students with industry leaders and exposing them to real-world challenges and solutions at PACK EXPO International, we are not only addressing immediate workforce needs but also investing in the future of our industries.”